Read Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Jennie S. Hwang

4.9/5 (32114 ratings)

Description:One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo- dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation- ships between these characteristics are clearly explained and pre- sented. In this excellent presentation, Dr. Hwang highlights three impor- tant areas of solder paste technology.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly. To get started finding Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.

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ISBN: 9401160503

Description: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo- dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation- ships between these characteristics are clearly explained and pre- sented. In this excellent presentation, Dr. Hwang highlights three impor- tant areas of solder paste technology.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly. To get started finding Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly, you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.

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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

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