Read Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering)

Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering)

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Description:This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a oorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering). To get started finding Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering), you are right to find our website which has a comprehensive collection of manuals listed.
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ISBN: 1461455073

Description: This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a oorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering). To get started finding Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering), you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.

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Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering)

Designing TSVs for 3D Integrated Circuits (SpringerBriefs in Electrical and Computer Engineering)

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