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Solder Joint Technology: Materials, Properties, and Reliability. Springer Series in Materials Science, Volume 92.

King-Ning Tu
4.9/5 (16265 ratings)
Description:Solder joints are ubiquitous in electronic consumer products. With the European Union's directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. This book offers a thorough examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Solder Joint Technology: Materials, Properties, and Reliability. Springer Series in Materials Science, Volume 92.. To get started finding Solder Joint Technology: Materials, Properties, and Reliability. Springer Series in Materials Science, Volume 92., you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.
Pages
376
Format
PDF, EPUB & Kindle Edition
Publisher
Springer
Release
2007
ISBN
1280957670

Solder Joint Technology: Materials, Properties, and Reliability. Springer Series in Materials Science, Volume 92.

King-Ning Tu
4.4/5 (1290744 ratings)
Description: Solder joints are ubiquitous in electronic consumer products. With the European Union's directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. This book offers a thorough examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Solder Joint Technology: Materials, Properties, and Reliability. Springer Series in Materials Science, Volume 92.. To get started finding Solder Joint Technology: Materials, Properties, and Reliability. Springer Series in Materials Science, Volume 92., you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.
Pages
376
Format
PDF, EPUB & Kindle Edition
Publisher
Springer
Release
2007
ISBN
1280957670
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